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Good chance for high tech PCBs factory

May 30, 2018

"Survival of the fittest" is an inevitable rule of industrial development.


In recent years, there have been successive closures of small and medium-sized factories in the PCB industry, especially in the Pearl River Delta where the production capacity was concentrated. There are many old PCB factories in Foshan, Guangzhou, Huizhou, Dongguan and other places that have gone bankrupt due to poor management.


In contrast, with the iteration of communication technology and the upgrading of product applications, higher requirements have been placed on the process and technological innovation of PCB boards, and the PCB industry pattern d on higher processes and technologies has become more stable. In order to achieve more component integration, smaller size, and smaller size and weight, PCB manufacturers have also ushered in a new mission, constantly advancing to high-end products, such as Any-layer HDI motherboards and SLP products.


"Step by step" of HDI


At present, d on China's supply chain integrity and maturity in the field of 5G infrastructure, PCB continues to develop in the direction of high density, high integration, high frequency and high speed, etc., in Pengding Holdings, Shennan Circuit, Hudian, Shengyi Technology In addition to the super-strong and multi-strong camp, Jingwang Electronics, Zhongjing Electronics, Chongda Technology, etc. are also continuing to catch up in the high-end PCB field.


Among them, as the HDI business with high technology and investment requirements in the PCB industry, the current market share of leading companies is only about 10%. In addition, Samsung / LG and other companies have divested HDI business last year, leaving the market space for first- and second-tier manufacturers. Large, high-end HDI has become a key point for domestic PCB manufacturers to continue to upgrade.


It is understood that due to factors such as high investment in high-end HDI production lines, high technical barriers, and strict environmental approvals for electroplating production lines, the current Taiwanese companies such as Pengding Holdings, Huatong, Xinxing, Dingying, etc. have shipment strength in HDI products. Strong, and benefited from high-end HDI process demand is strong, performance is good.


In contrast, mainland manufacturers, the capacity utilization rate of high-end PCB products last year was affected by the decline in downstream prosperity, and production capacity was not fully released. In order to increase the capacity utilization rate, major PCB manufacturers in the Mainland are "following step by step" in the field of high-end HDI. At present, some manufacturers have mass production capacity in the third-tier and below areas.


Judging from the disclosure of the 2019 annual reports of multiple PCB manufacturers, the author sorted out the progress of relevant manufacturers in the field of HDI, which may provide a glimpse of the progress and strength of current mainland manufacturers in high-end PCB products.


It is understood that the current HDI mass production of ultrasonic electronics is from first order to fourth order HDl, small batch production and technical reserves are from fifth order to sixth order, and its HDI (including class carrier) production capacity is 500,000 to 600,000 square meters; Zhongjing Electronics is The progress in the higher-level field is relatively advanced. In addition to the mass production capacity of high-level (more than three-level) high-level (more than 10 layers) products, 10-12 layers of fifth-level HDI products have successively completed sample production.


In addition, Zhuhai Fushan's high-density printed circuit board (PCB) construction project recently invested by Zhongjing Electronics has invested in the construction of phase 1-A, focusing on the development of high-end HDI, Anylayer HDI and SLP and other process products.


Dongshan Precision also said that its subsidiary MULTEK has more than three-tier HDI production capacity and is currently actively preparing for HDI capacity expansion. Jingwang Electronics disclosed that the HDI (including SLP) project is expected to be put into operation in the second quarter of 2021, mainly for any layer of HDI and HDI containing mSAP technology, taking into account a small amount of third-order HDI products.


It is worth noting that in the layout of the above-mentioned multiple PCB high-end production capacity, SLP's production capacity layout has appeared in the production capacity planning of many PCB manufacturers. "Driven by first-tier terminal manufacturers, high-end PCB products in the mainland have been continually laid out, and they need to accelerate their pace to keep up with the rhythm in order to occupy a place in the field of high-end products." Industry sources said to Jiwei.


SLP ready to go


In the PCB industry, the current high-end PCB product categories are mainly HDI, R-F, SLP, IC carrier boards, etc. Some analysts said that in the second half of the PCB industry transfer, mainland manufacturers will gradually seize the market share of high-end PCBs by virtue of cost and efficiency advantages.


As an advanced product of HDI, SLP carries stronger technological iteration requirements.


According to the data, SLP is d on HDI technology and adopts the M-SAP process to further refine the circuit of the new generation of fine printed circuit boards, greatly improving the integration of components and reducing the physical space of the PCB board. : "SLP boards for smartphones can carry twice the number of electronic components in the same area, and the penetration rate in future smartphones will continue to increase."


In addition, when Apple uses SLP on the iPhone 8 and iPhone X, some research institutions predict that the application of SLP will completely change the  substrate and PCB market.


Today, as the PCB industry continues to evolve toward higher integration, thinner, thinner, and more, the penetration rate of SLP in the field of smart phones will continue to increase, and the requirements for PCB materials and processes are also higher. "At present, there are more and more manufacturers deploying SLP, but in addition to Apple's blessed Pengding Holdings has achieved mass production, other domestic PCB manufacturers have a long way to go in mass production." The above-mentioned industry insiders said frankly.


It is understood that the leading PCB manufacturer Peng Ding Holdings' communications board products include FPC, HDI, RPCB, SLP and other high-end PCB products, and its customer system includes Apple, Goole, SONY, Huawei, OPPO, vivo and other domestic and foreign brands. According to the announcement, the minimum aperture of its printed circuit board products can reach 0.025mm and the minimum line width can reach 0.025mm. At present, it has formed the mass production capacity of the next-generation PCB product SLP that represents the requirements of higher-order processes.


As the core supplier of Apple's FPC + SLP, Peng Ding Holdings' SLP product revenue in 2018 accounted for about 4% -5% of its total revenue, and the Qinhuangdao fundraising project SLP has been partially put into production and will reach production in 2021.


Compared with the mass production strength of Pengding Holdings in the field of SLP, in addition to the partial mass production capacity of ultrasound manufacturers in the mainland, Zhongjing Electronics is a relatively early company.


Since last year, the investment and layout of Zhongjing Electronics ’coded high mult circuit board, high-end HDI and Anylayer HDI, rigid-flex board (RF), SLP (m-SAP) and other products have deeply penetrated into 5G communication, new high-definition display, Emerging market areas such as energy automotive electronics, medical epidemic prevention, artificial intelligence, Internet of Things, and big data and cloud computing will also be the key to the continued breakthrough of the domestic PCB one and two camps.


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